admin Understanding Chip Wet Decapsulation
Chip wet decapsulation is a process that removes the coverings (mold compound or encapsulant) of an integrated circuit (IC), exposing the die of the chip. This process is crucial for decapping chips to investigate faults or verify designs.
Chip wet decapsulation processes are divided into two main categories: mechanical and chemical. Mechanical processes, such as laser drilling or sandblasting, cannot differentiate between the mold compound and the IC’s package. Therefore, mechanical processes can cause significant damages to the chip that may render it unusable. On the other hand, chemical decapsulation offers more precise control while leaving the die relatively undamaged. Learn more about the topic covered in this article by checking out the suggested external site. There, you’ll find additional details and a different approach to the subject. chip wet decapsulation.
Choosing the Right Chemical Solution
Chemical solutions used in chip decapsulation to remove the mold compound need to have certain characteristics such as:
Some common chemical solutions for chip decapsulation include:
Piranha Solution
The Piranha solution–a mixture of concentrated sulfuric acid and hydrogen peroxide–is one of the commonly used decapsulation solutions for microchips. However, it is a very harsh solution that dissolves almost everything in its path. Therefore, it requires careful handling and rigorous safety precautions.
The Piranha solution is used for epoxy removal from semiconductor packages, especially in those where the conventional method using nitric acid to selectively etch the high lead solder plating is not effective.
Hydrated Ferric Chloride
Hydrated ferric chloride, also known as FeCl3 or ferric chloride, is one of the most common chemicals used for chip decapsulation. The hydrated version of Ferric Chloride is often preferred over others as it ensures faster dissolution of the mold compound, meaning that the process is more cost-effective and requires less time.
Fuming Nitric Acid (FNA)
Fuming nitric acid is used when removing aluminum wire bonds on shallow-angle bond pads. It is a hazardous solution, and safety precautions must be taken when handling it. This solution might cause damage to the die if the concentration or time is high. Therefore, it is best to optimize the conditions to avoid its negative impact.
Conclusion
In summary, choosing the right chemical solution for chip wet decapsulation is essential. The chemical solution must be effective in removing the mold compound while avoiding damages to the underlying die or wire bonds. Therefore, chemical decapsulation requires expertise to avoid jeopardizing the chip’s integrity, rendering it unusable. Plunge further into the subject by visiting this suggested external site. chip wet decapsulation https://decaplab.com/decapsulation-faq/, you’ll find more information and a different approach to the topic discussed.
Keep in mind that handling hazardous chemicals can be harmful to human health and the environment, and safety regulations must be followed when using these solutions. Adhering to safety precautions coupled with correct procedure at all stages of the process is required to achieve desirable results with minimal damages to the electronic chips.
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